[Signing of Packaging and Testing Projects for Memory Chips and SoC Chips] On May 18, 2026, a memory chip and SoC chip packaging and testing project with a total investment of 5 billion yuan was signed with Gaoyou High tech Zone. It is reported that the fixed assets investment of the memory chip and SoC chip packaging test project signed this time amounted to 2.2 billion yuan, which was promoted by phased construction and focused on the core link of the integrated circuit industry chain. After reaching full production capacity, it can generate invoice sales of 2 billion yuan annually. Editor/Cheng Liting

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• 2026.07.01 09:57
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